{"id":"root","topic":"中国两用物项出口管制公告","children":[{"id":"背景","topic":"法律法规依据","children":[{"id":"bg1","topic":"《中华人民共和国出口管制法》"},{"id":"bg2","topic":"《中华人民共和国两用物项出口管制条例》"},{"id":"bg3","topic":"经国务院批准"}]},{"id":"管制措施","topic":"八项具体规定","children":[{"id":"c1","topic":"一、境外特定出口经营者需获许可证","children":[{"id":"c1-1","topic":"（一）混合≥0.1%中国原产附件1物项"},{"id":"c1-2","topic":"（二）使用中国稀土技术在境外生产"},{"id":"c1-3","topic":"（三）原产于中国的附件1物项"}]},{"id":"c2","topic":"二、原则上不予许可的出口对象","children":[{"id":"c2-1","topic":"境外军事用户"},{"id":"c2-2","topic":"出口管制管控/关注名单主体及其控股≥50%分支机构"}]},{"id":"c3","topic":"三、原则上不予许可的最终用途","children":[{"id":"c3-1","topic":"大规模杀伤性武器及其运载工具"},{"id":"c3-2","topic":"恐怖主义目的"},{"id":"c3-3","topic":"军事用途或提升军事潜力"}]},{"id":"c4","topic":"四、逐案审批的特殊情形","children":[{"id":"c4-1","topic":"14nm及以下逻辑芯片"},{"id":"c4-2","topic":"256层及以上存储芯片"},{"id":"c4-3","topic":"上述制程半导体生产设备、测试设备、材料"},{"id":"c4-4","topic":"潜在军事用途的AI研发"}]},{"id":"c5","topic":"五、人道主义豁免及报告义务","children":[{"id":"c5-1","topic":"紧急医疗、公共卫生突发事件、自然灾害救助"},{"id":"c5-2","topic":"无需许可证，但须出口后10个工作日内邮件报告商务部"},{"id":"c5-3","topic":"承诺不危害中国安全与利益"}]},{"id":"c6","topic":"六、许可申请程序","children":[{"id":"c6-1","topic":"按《条例》第16条及商务部系统要求提交"},{"id":"c6-2","topic":"文件以中文为准"},{"id":"c6-3","topic":"可直接申请或委托境内机构"},{"id":"c6-4","topic":"咨询邮箱：jingwaizixun@mofcom.gov.cn"}]},{"id":"c7","topic":"七、合规义务","children":[{"id":"c7-1","topic":"境内出口经营者：报关填报最终目的国并出具《合规告知书》"},{"id":"c7-2","topic":"境外出口经营者：向下游出具《合规告知书》"}]},{"id":"c8","topic":"八、实施时间","children":[{"id":"c8-1","topic":"一（一）（二）：2025年12月1日起"},{"id":"c8-2","topic":"一（三）：公告发布之日起"}]}]},{"id":"附件","topic":"相关文件","children":[{"id":"a1","topic":"1.物项列表.wps"},{"id":"a2","topic":"2.《合规告知书》指引.wps"}]}]}

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